Wafer-Scale Micro-LEDs Transferred onto an Adhesive Film for Planar and Flexible Displays

2021-06-07 L  M  S 】

  Recognized as a next-generation display technology in the industry, Micro-LED displays have many advantages such as higher brightness, lower power consumption, longer life, higher resolution, and faster response speed, compared with liquid crystal display (LCD) and OLED display technologies. Therefore, they have very good application prospects for wearable electronic devices, outdoor displays and AR/VR helmet displays. However, the production of high-resolution Micro-LED display devices currently faces many challenges. Among them, how to quickly and accurately transfer and integrate hundreds of thousands or even millions of Micro-LED display chips into the drive circuit module is a hot research topic in the industry. Although researchers have proposed a variety of transfer technologies for micro-LED chips, there is still ample room for improvement in the transfer efficiency and accuracy. In addition, many transfer technologies mainly focus on the optimization of the chip transfer technology itself, but pay less attention to their compatibility with subsequent integration processes.

  Recently, researchers from the Institute of Semiconductors of the Guangdong Academy of Sciences have developed a tape-assisted laser lift-off transfer technology and corresponding flip-chip bonding technology. This technique is expected to solve the industry's problems regarding the massive chip transfer and heterogeneous integration of Micro-LEDs.  Based on this technique, the researchers have developed planar and flexible Micro-LED micro-display prototype devices. The related research work titled "Wafer-Scale Micro-LEDs Transferred onto an Adhesive Film for Planar and Flexible Displays" was published in an internationally renowned journal "Advanced Materials Technologies" (JCR 1 zone, Impact Factor: 5.969). Researchers from the Institute of Semiconductors of the Provincial Academy of Sciences are the leading authors. This work was financially supported by Guangdong Academy of Sciences and the Key Research and Development Project of Guangdong Province.